Company Filing History:
Years Active: 2016-2017
Title: The Innovations of Toshifumi Sagawa
Introduction
Toshifumi Sagawa is a notable inventor based in Hitachinaka, Japan. He has made significant contributions to the field of semiconductor devices and thermal sensors. With a total of 2 patents to his name, Sagawa's work has had a considerable impact on technology.
Latest Patents
Sagawa's latest patents include an adhesive sheet and methods for manufacturing semiconductor devices and thermal airflow sensors. The adhesive sheet is designed to improve adhesion by being divided into multiple sections, each with a thickness of approximately 0.1 mm or less. This innovative design allows for better correspondence to the shape of the adherend and enhances stickiness through the application of external energy. Additionally, his thermal type airflow volume meter improves measurement accuracy and includes a method for manufacturing the same.
Career Highlights
Sagawa is currently employed at Hitachi Automotive Systems, Ltd., where he continues to develop cutting-edge technologies. His work in power semiconductor modules features a can-type cooling case that incorporates a plate spring portion to generate compressive stress in the semiconductor circuit unit. This design also includes an adjustment portion for elastic deformation, showcasing his innovative approach to engineering.
Collaborations
Sagawa has collaborated with notable coworkers such as Masato Higuma and Takahiro Shimura, contributing to a dynamic work environment that fosters innovation.
Conclusion
Toshifumi Sagawa's contributions to the fields of semiconductor devices and thermal sensors highlight his role as a leading inventor. His innovative patents and career at Hitachi Automotive Systems, Ltd. reflect his commitment to advancing technology.