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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9474191 B1

PDFFull Text
Date of Patent:
Oct. 18, 2016

Filed:

Feb. 08, 2013

Power semiconductor module

Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;

Inventors:

Masato Higuma, Hitachinaka, JP;

Toshifumi Sagawa, Hitachinaka, JP;

Takahiro Shimura, Hitachinaka, JP;

Hideto Yoshinari, Hitachinaka, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:

Crowell & Moring LLP

Primary Examiner:

Tuan T Dinh

Assistant Examiner:

Mukund G Patel

Int. Cl.
CPC ...
H05K 7/20 (2006.01); H02M 7/00 (2006.01); H01L 23/36 (2006.01); H01L 21/48 (2006.01); H01L 23/473 (2006.01); H05K 5/06 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); H01L 21/4878 (2013.01); H01L 23/36 (2013.01); H01L 23/473 (2013.01); H02M 7/003 (2013.01); H05K 5/069 (2013.01); H05K 7/20927 (2013.01); H01L 23/3107 (2013.01); H01L 23/4334 (2013.01); H01L 23/49562 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/40247 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73213 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30107 (2013.01);
Abstract

Each of a plurality of power semiconductor module includes a can-type cooling case that is formed with a plate spring portion that generates compressive stress in the semiconductor circuit unit, an adjustment portion that is deformed to adjust elastic deformation of the plate spring portion, and a sidewall portion to which the plate spring portion and the adjustment portion are joined.

Find Patent Forward Citations

Higuma, Masato. (2016). Power semiconductor module (U.S. Patent No. 9474191). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9474191

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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