This inventor holds 23 USPTO granted patents and 1 EPO patent, primarily in Lead-Free Solder Technology. Top assignees: Hitachi, Ltd., Renesas Electronics Corporation, Renesas Technology Corp.. Active years: 1999-2022.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Fujisawa, JP (2010 - 2011)
- Yokohama, JP (1999 - 2014)
- Tokyo, JP (2006 - 2022)
Company Filing History:
17 out of 42,726 
3 out of 7,651 
3 out of 3,781 
Years Active: 1999-2022
Areas of Expertise:
Title: Tetsuya Nakatsuka: Innovator in Sealing Structures and Bonded Electronics
Introduction
Tetsuya Nakatsuka is a renowned inventor based in Yokohama, Japan, holding an impressive 23 patents throughout his career. His contributions to innovations in sealing structures and electronic materials have made a significant impact in the fields of technology and engineering.
Latest Patents
Among his latest inventions is a sealing structure and manufacturing method thereof. This innovation provides a unique sealing structure that includes a housing designed to contain either a heat generating or heat dissipation member. The design encompasses a resin filled within the housing, featuring a first recess portion strategically positioned to enhance functionality.
Another notable patent is the lead-free solder-connected structure, which presents a bonded structure utilizing a lead-free solder. This advancement is incorporated into electronic articles and offers a stable bonding interface that withstands the test of time. Its construction includes a lead-free Sn–Ag–Bi alloy solder applied to an electrode through an Sn–Bi alloy layer, resulting in excellent wettability and strong bonding characteristics. Additionally, a copper layer underneath the Sn–Bi alloy layer ensures enough bonding strength, contributing to increased reliability in electronic applications.
Career Highlights
Tetsuya Nakatsuka's career features significant tenures at prominent companies such as Hitachi, Ltd. and Renesas Technology Corporation. His experience at these leading technology firms has been instrumental in shaping his expertise and innovation in the field of electronics and materials science.
Collaborations
Throughout his journey, Nakatsuka has collaborated with talented colleagues including Tasao Soga and Hanae Shimokawa. Their combined efforts have fostered an environment of creativity and innovation, leading to remarkable advancements in their respective areas of expertise.
Conclusion
Tetsuya Nakatsuka's unwavering commitment to innovation is evident in his considerable number of patents and groundbreaking inventions. His work in sealing structures and bonded electronic materials continues to influence the industry, establishing him as a prominent figure among contemporary inventors. As technology progresses, Nakatsuka’s contributions will undoubtedly remain influential in future developments.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile