The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2006
Filed:
Apr. 25, 2002
Tetsuya Nakatsuka, Yokohama, JP;
Masahide Okamoto, Yokohama, JP;
Tomoyuki Ohmura, Yokohama, JP;
Asao Nakano, Kamakura, JP;
Tetsuya Nakatsuka, Yokohama, JP;
Masahide Okamoto, Yokohama, JP;
Tomoyuki Ohmura, Yokohama, JP;
Asao Nakano, Kamakura, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
The present invention relates to a wave soldering method and a wave soldering apparatus using lead-free solder comprising a wave soldering step in which the lower side of a substrate with leads of component parts inserted in through-holes formed in the substrate from the upper side is wave soldered by contact with a molten lead-free solder blowout at a wave soldering portion provided in a chamber, and a cooling step in which an inert gas in the chamber is recirculated and cooled and is blown to the lower side of the substrate wave soldered with the lead-free solder in the wave soldering step and being conveyed, to cool the lower side of the substrate, at a blowing portion provided adjacently to the wave soldering portion in the chamber, and an apparatus therefor.