The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2006
Filed:
Oct. 08, 2002
Kazuma Miura, Yokohama, JP;
Hanae Shimokawa, Yokohama, JP;
Koji Serizawa, Fujisawa, JP;
Tasao Soga, Yokohama, JP;
Tetsuya Nakatsuka, Yokohama, JP;
Kazuma Miura, Yokohama, JP;
Hanae Shimokawa, Yokohama, JP;
Koji Serizawa, Fujisawa, JP;
Tasao Soga, Yokohama, JP;
Tetsuya Nakatsuka, Yokohama, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A semiconductor module solder bonding of high reliability in which the heat resisting properties of the circuit substrate and electronic parts are taken into consideration. In order to achieve this, there are provided semiconductor devices each having solder bumps as external pads, and a circuit substrate bonded to the external pads of each of the semiconductor devices through a solder paste, each of the solder bumps being made of a first lead-free solder, the solder paste being made of a second lead-free solder having a melting point lower than that of the first lead-free solder.