The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2010
Filed:
Dec. 19, 2001
Tasao Soga, Hitachi, JP;
Hanae Hata, Yokohama, JP;
Toshiharu Ishida, Fujisawa, JP;
Kanko Ishida, Legal Representative, Fujisawa, JP;
Tetsuya Nakatsuka, Fujisawa, JP;
Masahide Okamoto, Yokohama, JP;
Kazuma Miura, Sanjo, JP;
Tasao Soga, Hitachi, JP;
Hanae Hata, Yokohama, JP;
Toshiharu Ishida, Fujisawa, JP;
Kanko Ishida, legal representative, Fujisawa, JP;
Tetsuya Nakatsuka, Fujisawa, JP;
Masahide Okamoto, Yokohama, JP;
Kazuma Miura, Sanjo, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A solder foil formed from a material comprising particles of Cu, etc. as metal particles and Sn particles as solder particles by rolling is suitable for solder bonding at a high temperature side in temperature-hierarchical bonding, and semiconductor devices and electronic devices produced by use of such solder bonding have distinguished reliability of mechanical characteristics, etc.