The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2007
Filed:
Mar. 22, 2002
Applicants:
Tasao Soga, Fujisawa, JP;
Hanae Shimokawa, Yokohama, JP;
Tetsuya Nakatsuka, Yokohama, JP;
Kazuma Miura, Yokohama, JP;
Mikio Negishi, Komoro, JP;
Hirokazu Nakajima, Saku, JP;
Tsuneo Endoh, Komoro, JP;
Inventors:
Tasao Soga, Fujisawa, JP;
Hanae Shimokawa, Yokohama, JP;
Tetsuya Nakatsuka, Yokohama, JP;
Kazuma Miura, Yokohama, JP;
Mikio Negishi, Komoro, JP;
Hirokazu Nakajima, Saku, JP;
Tsuneo Endoh, Komoro, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, etc., and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.