Hitachinaka, Japan

Toshihiro Hachiya


Average Co-Inventor Count = 10.0

ph-index = 2

Forward Citations = 27(Granted Patents)


Company Filing History:


Years Active: 2003-2004

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2 patents (USPTO):

Title: Innovations by Toshihiro Hachiya

Introduction

Toshihiro Hachiya, an accomplished inventor based in Hitachinaka, Japan, has significantly contributed to the field of electronic devices with two noteworthy patents. His work focuses on enhancing the reliability and durability of electronic equipment, particularly in challenging environments.

Latest Patents

Hachiya's latest inventions include improvements in electronic devices that aim to enhance falling down shock resistance and impact resistance. One of his notable patents addresses the durability of solder joints in semiconductor devices, specifically die-bonded silicon chips. The electronic equipment he developed integrates circuit boards and electronic parts that are electrically connected through soldering. This process utilizes a lead-free solder consisting of copper (Cu: 0-2.0 mass%), indium (In: 0.1-10 mass%), and tin (Sn: the remaining amount). This innovation is crucial for applications involving bump mounting of ball grid arrays (BGA), chip-scale packages (CSP), and flip-chips, amongst others.

Career Highlights

Toshihiro Hachiya is currently employed by Hitachi, Ltd., where he continues to push the boundaries of innovation in electronic device technology. His dedication to enhancing the operational reliability and performance of electronic components is evident through his patented work.

Collaborations

Throughout his career, Hachiya has collaborated with several talented colleagues at Hitachi, including Tasao Soga and Hanae Shimokawa. These collaborations have fostered an environment of innovation, leading to advancements in electronic technology that benefit various industries.

Conclusion

Toshihiro Hachiya stands out as a prominent figure in the realm of electronics and patents. His inventions not only enhance the shock resistance of electronic devices but also significantly improve the reliability of solder joints in semiconductor technology. As he continues to innovate, Hachiya's contributions will undoubtedly leave a lasting impact on the industry.

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