The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2001
Filed:
Jun. 01, 1999
Tasao Soga, Hitachi, JP;
Toshiharu Ishida, Fujisawa, JP;
Tetsuya Nakatsuka, Yokohama, JP;
Hanae Shimokawa, Yokohama, JP;
Koji Serizawa, Fujisawa, JP;
Yasuo Amano, Yokohama, JP;
Suguru Sakaguchi, Chigasaki, JP;
Hiroshi Yamaguchi, Fujisawa, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
Electronic components are bonded to an electronic circuit board with a lead-free solder. The bonded structure is cooled from a temperature close to the liquids temperature of the solder to a temperature close to the solids temperature of the solder at a first cooling rate of about 10 to 20° C./second, followed by cooling the bonded structure to a temperature lower than the solids temperature of the solder at a second cooling rate of about 0.1 to less than 5° C./second.