Hitachi, Ltd.

Renesas Technology Corp.

Koji Serizawa

Tetsuya Nakatsuka

Tasao Soga

Hanae Shimokawa

Suguru Sakaguchi

Hiroyuki Tanaka

Toshiharu Ishida

Ichiro Miyano

Tadao Shinoda

Masahide Okamoto

Yuji Fujita

Masato Nakamura

Kazuma Miura

Hideki Mukuno

Toshihiro Hachiya

Hiroshi Yamaguchi

Yasuo Amano

The present invention proposes a semiconductor device including a semiconductor chip having a plurality of electrodes, a plurality of leads electrically connected to the plurality of electrodes of the semiconductor chip by bonding wires, and a resin for implementing the semiconductor chip, wherein the plurality of leads are comprised of two or more kinds of leads having different rigidities.

Electronic component with varying rigidity leads using Pb-free solder

A semiconductor module solder bonding of high reliability in which the heat resisting properties of the circuit substrate and electronic parts are taken into consideration. In order to achieve this, there are provided semiconductor devices each having solder bumps as external pads, and a circuit substrate bonded to the external pads of each of the semiconductor devices through a solder paste, each of the solder bumps being made of a first lead-free solder, the solder paste being made of a second lead-free solder having a melting point lower than that of the first lead-free solder.

Semiconductor device having solder bumps reliably reflow solderable

An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0-2.0 mass %, In: 0.1-10 mass %, and Sn: remaining amount.

Electronic device

An electronic equipment is capable of improving falling down shock resistance or impact resistance in an electronic equipment and of improving reliability of a solder joint in a semiconductor device die-bonded Si chip or the like to which thermal shock causing large deformation may act, bump mounting of BGA, CSP, WPP, flip-chip and so forth, a power module acting large stress and so forth. The electronic equipment has a circuit board and an electronic parts to be electrically connected to an electrode of the circuit board. The electrode of the circuit board and an electrode of the electronic part are connected by soldering using a lead free solder consisted of Cu: 0&tilde;2.0 mass %, In: 0.1&tilde;10 mass %, and Sn: remaining amount.

Electron device and semiconductor device

Semiconductor module having solder bumps and solder portions with different materials and compositions and circuit substrate

A film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof wherein a plurality of chip semiconductor devices are laminated onto a substrate. Each chip semiconductor device includes a film carrier tape having leads, a semiconductor chip electrically connected to the leads, a heat sink mounted to a surface of the chip, and a connector for mounting the heat sink, the connector being electrically connected to the leads of the film carrier tape. The film carrier tape includes a carrier member having a metallic layer superposed thereon which is etched so as to form the leads and the heat sink.

Film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof

Electronic components are bonded to an electronic circuit board with a lead-free solder. The bonded structure is cooled from a temperature close to the liquids temperature of the solder to a temperature close to the solids temperature of the solder at a first cooling rate of about 10 to 20&deg; C./second, followed by cooling the bonded structure to a temperature lower than the solids temperature of the solder at a second cooling rate of about 0.1 to less than 5&deg; C./second.

Method and apparatus of manufacturing an electronic circuit board

A film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof wherein a plurality of chip-semiconductor devices are laminated onto a substrate. Each chip semiconductor device includes a film carrier tape having leads, a semiconductor chip electrically connected to the leads, a heat sink mounted to a surface of the chip, and a connector for mounting the heat sink, the connector being electrically connected to the leads of the film carrier tape. The film carrier tape includes a carrier member having a metallic layer superposed thereon which is etched so as to form the leads and the heat sink.

Growing community of inventors

Fujisawa, Japan

Koji Serizawa