Hsinchu, Taiwan

Kevin Lee

This inventor holds 4 USPTO granted patents. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., United Microelectronics Corp.. Active years: 2003-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kevin Lee. Retrieved from https://idiyas.com/inventor/kevin-lee-l3ukdl3r

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.7

ph-index = 2

Forward Citations = 27(Granted Patents)


Company Filing History:


Years Active: 2003-2025

Loading Chart...
4 patents (USPTO):Explore Patents

Title: Kevin Lee: Innovator in Semiconductor Technology

Introduction

Kevin Lee is a prominent inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His innovative work has advanced the development of semiconductor devices, showcasing his expertise and creativity.

Latest Patents

Kevin Lee's latest patents include groundbreaking inventions that enhance semiconductor device functionality. One of his notable patents is titled "Contact features of semiconductor device and method of forming same." This invention outlines a method for forming a dielectric layer over a source/drain region, which involves creating an opening that exposes part of the source/drain region. A conductive liner is then formed, followed by a surface modification process that results in a surface coating layer. This innovative approach allows for the filling of the opening with conductive material in a bottom-up manner, ensuring effective contact with the conductive liner and dielectric layer.

Another significant patent is "Package of a semiconductor device with a flexible wiring substrate and method for the same." This invention describes a semiconductor device package that includes a semiconductor substrate with at least one pad, a bump bonded to the pad, and a flexible wiring substrate. The flexible wiring substrate is directly conductively attached to the semiconductor substrate, which reduces package size and manufacturing costs.

Career Highlights

Throughout his career, Kevin Lee has worked with leading companies in the semiconductor industry. He has been associated with United Microelectronics Corporation and Taiwan Semiconductor Manufacturing Company Limited. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Kevin has collaborated with notable professionals in the field, including Joseph Z. Sun and Kuang-Chih Cheng. These collaborations have further enriched his work and expanded the impact of his inventions.

Conclusion

Kevin Lee is a distinguished inventor whose contributions to semiconductor technology have been invaluable. His innovative patents and career achievements reflect his dedication to advancing the field. His work continues to influence the development of efficient and cost-effective semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…