The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 04, 2007
Filed:
Jan. 27, 2005
Joseph Sun, Hsin-Chu, TW;
Kuang-chih Cheng, Yun-Lin, TW;
Ming-chieh Chen, Hsin-Chu, TW;
Kevin Lee, Hsin-Chu, TW;
Jui-hsiang Pan, Hsin-Chu, TW;
Joseph Sun, Hsin-Chu, TW;
Kuang-Chih Cheng, Yun-Lin, TW;
Ming-Chieh Chen, Hsin-Chu, TW;
Kevin Lee, Hsin-Chu, TW;
Jui-Hsiang Pan, Hsin-Chu, TW;
United Microelectronics Corp., Hsin-Chu, TW;
Abstract
A package of a semiconductor device with a flexible wiring substrate and a method thereof are provided. The package of the semiconductor device includes a semiconductor substrate with at least one pad on a surface thereof, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate having at least one contact section being electrically connected with the bump by the adhesive layer. The present invention makes the flexible wiring substrate directly conductively attached onto the semiconductor substrate. The package size is shrunk and the cost down can be obtained.