Joseph Z Sun

Title: Joseph Z Sun: Innovator in Semiconductor Packaging

Introduction

Joseph Z Sun is a prominent inventor based in Feng Shan, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His innovative approaches have led to advancements that enhance the efficiency and cost-effectiveness of semiconductor devices.

Latest Patents

One of Joseph Z Sun's latest patents is titled "Package of a semiconductor device with a flexible wiring substrate and method for the same." This invention provides a package for a semiconductor device that includes a semiconductor substrate with at least one pad on its surface, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate. The flexible wiring substrate has at least one contact section that is electrically connected to the bump via the adhesive layer. This innovative design allows the flexible wiring substrate to be directly conductively attached to the semiconductor substrate, resulting in a reduced package size and lower costs.

Career Highlights

Throughout his career, Joseph Z Sun has worked with notable companies, including United Microelectronics Corporation. His expertise in semiconductor technology has positioned him as a key player in the industry, contributing to various advancements in device packaging.

Collaborations

Joseph has collaborated with talented individuals such as Kuang-Chih Cheng and Ming-Chieh Chen. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Joseph Z Sun is a distinguished inventor whose work in semiconductor packaging has led to significant advancements in the field. His innovative patents and collaborations highlight his commitment to improving technology and reducing costs in semiconductor devices.