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For the Inventor, By the Inventor

Linnei, Taiwan

Kuang-Chih Cheng

This inventor holds 7 USPTO granted patents. Top assignee: United Microelectronics Corp.. Active years: 2005-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kuang-Chih Cheng. Retrieved from https://idiyas.com/inventor/kuang-chih-cheng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7

% Patents Active = 85.7

Average Co-Inventor Count = 3.7

ph-index = 4

Forward Citations = 58(Granted Patents)


Location History:

  • Yun-Lin Hsien, TW (2005)
  • Linnei, TW (2006)
  • Yunlin, TW (2006 - 2010)
  • Linnei Township, Yunlin County, TW (2008 - 2010)

Company Filing History:

goldMedal7 out of 7,278 
 
United Microelectronics Corp.
 patents

Years Active: 2005-2010

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7 patents (USPTO):Explore Patents
1. 7663693 - Camera module (2010-02-16),
2. 7663234 - Package of a semiconductor device with a flexible wiring substrate and method for the same (2010-02-16),
3. 7359002 - Camera module and method for packaging the same (2008-04-15),
4. 7303400 - Package of a semiconductor device with a flexible wiring substrate and method for the same (2007-12-04),
5. 7060592 - Image sensor and fabricating method thereof (2006-06-13),
6. 7009287 - Chip on photosensitive device package structure and electrical connection thereof (2006-03-07),
7. 6930398 - Package structure for optical image sensing integrated circuits (2005-08-16),

Title: Innovations of Kuang-Chih Cheng

Introduction

Kuang-Chih Cheng is a prominent inventor based in Linnei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

One of his latest patents is titled "Package of a semiconductor device with a flexible wiring substrate and method for the same." This invention provides a package for a semiconductor device that includes a semiconductor substrate with at least one pad on its surface, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate. The flexible wiring substrate is directly conductively attached to the semiconductor substrate, resulting in a reduced package size and lower costs.

Another notable patent is for a "Camera module." This camera module comprises a lens, a holder, a circuit board, and an image sensing and processing unit. The design allows for the image sensing and processing unit to be packaged on one side of the circuit board, enhancing the overall mechanical strength when a hard plate is added to the flexible PCB.

Career Highlights

Kuang-Chih Cheng is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His innovative work has positioned him as a key figure in the development of advanced semiconductor technologies.

Collaborations

He has collaborated with notable coworkers, including Cheng-Kuang Sun and Kuang-Shin Lee, contributing to various projects that push the boundaries of semiconductor applications.

Conclusion

Kuang-Chih Cheng's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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