The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7009287 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 07, 2006

Filed:

Mar. 01, 2004
Applicants:

Cheng-kuang Sun, Hsinchu, TW;

Kuang-chih Cheng, Linnei, TW;

Kuang-shin Lee, Hsinchu, TW;

Inventors:

Cheng-Kuang Sun, Hsinchu, TW;

Kuang-Chih Cheng, Linnei, TW;

Kuang-Shin Lee, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

A chip on photosensitive device package structure is provided. The package mainly comprises a photosensitive device, a transparent plate and a chip. The photosensitive device has an illumination area and a non-illumination area. The transparent plate has a first surface and a corresponding second surface. The transparent plate is set over the photosensitive device with the first surface covering both the illumination area and the non-illumination area. The chip is set on the second surface of the transparent plate above the non-illumination area of the photosensitive device.


Find Patent Forward Citations

Sun, Cheng-Kuang. (2006). Chip on photosensitive device package structure and electrical connection thereof (U.S. Patent No. 7009287). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7009287

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