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For the Inventor, By the Inventor

Hsinchu, Taiwan

Kuang-Shin Lee

This inventor holds 7 USPTO granted patents. Top assignee: United Microelectronics Corp.. Active years: 2005-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kuang-Shin Lee. Retrieved from https://idiyas.com/inventor/kuang-shin-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7

% Patents Active = 85.7

Average Co-Inventor Count = 3.2

ph-index = 4

Forward Citations = 39(Granted Patents)


Company Filing History:

goldMedal7 out of 7,285 
 
United Microelectronics Corp.
 patents

Years Active: 2005-2010

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7 patents (USPTO):Explore Patents
1. 7663693 - Camera module (2010-02-16),
2. 7531381 - Manufacturing method of a quad flat no-lead package structure (2009-05-12),
3. 7291908 - Quad flat no-lead package structure and manufacturing method thereof (2007-11-06),
4. 7060592 - Image sensor and fabricating method thereof (2006-06-13),
5. 7009287 - Chip on photosensitive device package structure and electrical connection thereof (2006-03-07),
6. 6930398 - Package structure for optical image sensing integrated circuits (2005-08-16),
7. 6921681 - Process for manufacturing photosensitive module (2005-07-26),

Title: Kuang-Shin Lee: Innovator in Camera Module Technology

Introduction

Kuang-Shin Lee is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of camera module technology, holding a total of 7 patents. His work has been instrumental in advancing the capabilities of imaging devices.

Latest Patents

One of his latest patents is for a camera module that includes a lens, a holder, a circuit board, and an image sensing and processing unit. This innovative design allows for enhanced mechanical strength when using a flexible circuit board. Another notable patent involves a manufacturing method for a quad flat no-lead package structure, which includes a chip carrier and multiple chips. This method utilizes various technologies to ensure efficient attachment of chips to the carrier.

Career Highlights

Kuang-Shin Lee is currently employed at United Microelectronics Corporation, where he continues to develop cutting-edge technologies. His expertise in camera modules and packaging structures has positioned him as a key player in the semiconductor industry.

Collaborations

He has collaborated with notable coworkers such as Cheng-Kuang Sun and Jui-Hsiang Pan, contributing to various innovative projects within the company.

Conclusion

Kuang-Shin Lee's contributions to camera module technology and packaging methods highlight his role as a leading inventor in the field. His patents reflect a commitment to innovation and excellence in technology development.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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