Ming-Chieh Chen

Title: Innovations of Ming-Chieh Chen

Introduction

Ming-Chieh Chen is a notable inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

One of his latest patents is titled "Package of a semiconductor device with a flexible wiring substrate and method for the same." This invention provides a package for a semiconductor device that includes a semiconductor substrate with at least one pad on its surface, a bump bonded to the pad, an adhesive layer on the bump, and a flexible wiring substrate. The flexible wiring substrate is directly conductively attached to the semiconductor substrate, resulting in a reduced package size and lower costs.

Another significant patent is for a "Camera module." This camera module comprises a lens, a holder, a circuit board, and an image sensing and processing unit. The image sensing and processing unit is packaged on one side of the circuit board, with the holder fixed on the circuit board. If the circuit board is flexible, a hard plate can be added to enhance mechanical strength.

Career Highlights

Ming-Chieh Chen is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His work at this organization has allowed him to develop innovative solutions that address current technological challenges.

Collaborations

He has collaborated with notable coworkers, including Kuang-Chih Cheng and Joseph Z Sun, contributing to various projects that enhance semiconductor technology.

Conclusion

Ming-Chieh Chen's contributions to semiconductor technology through his patents and work at United Microelectronics Corporation highlight his role as an influential inventor in the field. His innovations continue to shape the future of semiconductor devices.