Keum-Hee Ma is a prominent inventor based in Andong-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His work focuses on innovative solutions that enhance the performance and efficiency of microelectronic devices.

Latest Patents

One of his latest patents is titled "Multi-chip package having semiconductor chips of different thicknesses from each other and related device." This invention provides a semiconductor device that includes a first semiconductor chip, a sub-board, and at least one second semiconductor chip. The design allows for different thicknesses among the chips, which can improve the overall functionality of the device. Another notable patent is "Through-silicon via structures providing reduced solder spreading and methods of fabricating the same." This patent describes a microelectronic device structure that includes a conductive via with a unique design to enhance solder wetting and improve device reliability.

Career Highlights

Keum-Hee Ma is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to the development of advanced microelectronic devices.

Collaborations

Throughout his career, Ma has collaborated with notable colleagues, including Kang-Wook Lee and Yong-Chai Kwon. These collaborations have fostered innovation and have led to the successful development of several patented technologies.

Conclusion

Keum-Hee Ma's contributions to semiconductor technology are noteworthy, and his patents reflect his commitment to innovation in the field. His work continues to influence the development of advanced microelectronic devices, showcasing the importance of creativity and collaboration in technological advancements.

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