The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2007
Filed:
Jul. 11, 2005
Yong-chai Kwon, Suwon-si, KR;
Kang-wook Lee, Suwon-si, KR;
Gu-sung Kim, Seongnam-si, KR;
Seong-il Han, Suwon-si, KR;
Keum-hee MA, Andong-si, KR;
Suk-chae Kang, Yongin-si, KR;
Dong-hyeon Jang, Suwon-si, KR;
Yong-Chai Kwon, Suwon-si, KR;
Kang-Wook Lee, Suwon-si, KR;
Gu-Sung Kim, Seongnam-si, KR;
Seong-Il Han, Suwon-si, KR;
Keum-Hee Ma, Andong-si, KR;
Suk-Chae Kang, Yongin-si, KR;
Dong-Hyeon Jang, Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
An image sensor device including a protective plate may be manufactured from an image sensor chip having an active surface and a back surface opposite to the active surface. The image sensor chip may include chip pads formed in a peripheral region of the active surface, a microlens formed in a central region of the active surface and an intermediate region between the peripheral and central regions. A protective plate may be attached to the intermediate region of the active surface of the image sensor chip using an adhesive pattern that is sized and configured to maintain a separation distance between the protective plate and the microlens formed on the image sensor chip. Conductive plugs, formed before, during or after the manufacture of the image sensor chip circuitry may provide electrical connection between the chip pads and external connectors.