The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2013
Filed:
Jan. 25, 2011
Keum-hee MA, Gyeonggi-do, KR;
Woo-dong Lee, Hwasung, KR;
Min-seung Yoon, Seoul, KR;
Ju-il Choi, Suwon-si, KR;
Sang-sick Park, Hwaseong-si, KR;
Son-kwan Hwang, Yongtong-gu, KR;
Keum-Hee Ma, Gyeonggi-do, KR;
Woo-Dong Lee, Hwasung, KR;
Min-Seung Yoon, Seoul, KR;
Ju-Il Choi, Suwon-si, KR;
Sang-Sick Park, Hwaseong-si, KR;
Son-Kwan Hwang, Yongtong-gu, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
A semiconductor device having semiconductor chips of different thicknesses is provided. The semiconductor device may include a first semiconductor chip, a sub-board on a first side of the first semiconductor chip, at least one second semiconductor chip on a second side of the first semiconductor chip, at least one external contact terminal on the at least one second semiconductor chip. In example embodiments the at least one second semiconductor chip may include a plurality of through silicon vias and the at least one external contact terminal may be in electrical contact with the first semiconductor chip and the at least one second semiconductor chip via the plurality of through silicon vias. In example embodiments, the at least one second semiconductor chip may be thinner than the first semiconductor chip.