The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2012
Filed:
Sep. 24, 2009
Son-kwan Hwang, Gyeonggi-do, KR;
Keum-hee MA, Gyeongsangbuk-do, KR;
Seung-woo Shin, Gyeonggi-do, KR;
Min-seung Yoon, Seoul, KR;
Jong-ho Yun, Gyeonggi-do, KR;
Ui-hyoung Lee, Seoul, KR;
Son-Kwan Hwang, Gyeonggi-do, KR;
Keum-Hee Ma, Gyeongsangbuk-do, KR;
Seung-Woo Shin, Gyeonggi-do, KR;
Min-Seung Yoon, Seoul, KR;
Jong-Ho Yun, Gyeonggi-do, KR;
Ui-Hyoung Lee, Seoul, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A microelectronic device structure as provided herein includes a conductive via having a body portion extending into a substrate from an upper surface thereof and a connecting portion laterally extending along the upper surface of the substrate. The connecting portion includes a recess therein opposite the upper surface of the substrate. The recess is confined within the connecting portion of the conductive via and does not extend beneath the upper surface of the substrate. A microelectronic device structure is also provided that includes a conductive via having a body portion extending into a substrate from an upper surface thereof and an end portion below the upper surface of the substrate. The end portion has a greater width than that of the body portion. A solder wettable layer is provided on the end portion. The solder wettable layer is formed of a material having a greater wettability with a conductive metal than that of the end portion of conductive via. Related methods of fabrication are also discussed.