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For the Inventor, By the Inventor

Kokubu, Japan

Kenji Kitazawa

This inventor holds 16 USPTO granted patents, primarily in High Frequency Modules. Top assignee: Kyocera Corporation. Active years: 1997-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kenji Kitazawa. Retrieved from https://idiyas.com/inventor/kenji-kitazawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 16

% Patents Active = 68.8

Average Co-Inventor Count = 3.1

ph-index = 12

Forward Citations = 630(Granted Patents)


Location History:

  • Kagoshima, JP (1999 - 2002)
  • Kokubu, JP (1997 - 2007)
  • Kirishima, JP (2008)

Company Filing History:

goldMedal16 out of 6,938 
 
Kyocera Corporation
 patents

Years Active: 1997-2008

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Areas of Expertise:
High Frequency Module
Dielectric Waveguide
Wiring Board
Communication Apparatus
Ceramic Resistor
Electrostatic Chuck
Transmission Line
Mount Structure
Surface-Acoustic-Wave-Device
High-Frequency Package
Branching Filter
Wafer Support Member
16 patents (USPTO):Explore Patents
1. 7352105 - Surface-acoustic-wave-device mount substrate, high-frequency module using the same, and communication apparatus (2008-04-01),
2. 7289008 - High-frequency module and communication apparatus (2007-10-30),
3. 6961245 - High frequency module (2005-11-01),
4. 6927653 - Dielectric waveguide type filter and branching filter (2005-08-09),
5. 6873529 - High frequency module (2005-03-29),
6. 6870438 - Multi-layered wiring board for slot coupling a transmission line to a waveguide (2005-03-22),
7. 6642808 - High frequency package, wiring board, and high frequency module having a cyclically varying transmission characteristic (2003-11-04),
8. 6501352 - High frequency wiring board and its connecting structure (2002-12-31),
9. 6483406 - High-frequency module using slot coupling (2002-11-19),
10. 6356173 - High-frequency module coupled via aperture in a ground plane (2002-03-12),
11. 6239669 - High frequency package (2001-05-29),
12. 6057600 - Structure for mounting a high-frequency package (2000-05-02),
13. 5952709 - High-frequency semiconductor device and mounted structure thereof (1999-09-14),
14. 5886863 - Wafer support member (1999-03-23),
15. 5777543 - Ceramic resistor and electrostatic chuck having an aluminum nitride (1998-07-07),

Title: Kenji Kitazawa: Innovator in High-Frequency Technology

Introduction

Kenji Kitazawa is a prominent inventor based in Kokubu, Japan. He has made significant contributions to the field of high-frequency technology, holding a total of 16 patents. His work focuses on the development of advanced communication devices and modules that enhance the performance of electronic systems.

Latest Patents

Among his latest patents are innovations such as a surface-acoustic-wave-device mount substrate and a high-frequency module utilizing this technology. The surface-acoustic-wave-device mount substrate features a multilayered insulating substrate that allows for the efficient mounting of surface-acoustic-wave devices. This design includes a ring-shaped ground electrode that is electrically connected to a conductor pattern on the substrate's back surface through multiple via-conductors. Additionally, his high-frequency module integrates transmitting and receiving filters along with high-frequency power amplifiers on a multilayered substrate, optimizing the overall size and functionality of communication apparatuses.

Career Highlights

Kenji Kitazawa has built a successful career at Kyocera Corporation, where he has been instrumental in advancing high-frequency technology. His innovative designs have not only improved device performance but have also contributed to the miniaturization of electronic components, making them more efficient and effective in various applications.

Collaborations

Throughout his career, Kitazawa has collaborated with notable colleagues, including Shinichi Koriyama and Hidehiro Minamiue. These partnerships have fostered a creative environment that has led to groundbreaking advancements in their field.

Conclusion

Kenji Kitazawa's contributions to high-frequency technology and his impressive portfolio of patents underscore his role as a leading inventor in the industry. His work continues to influence the development of advanced communication systems, showcasing the importance of innovation in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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