The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2008
Filed:
Feb. 23, 2006
Hiroyuki Mori, Kirishima, JP;
Kenji Kitazawa, Kirishima, JP;
Hiroyuki Mori, Kirishima, JP;
Kenji Kitazawa, Kirishima, JP;
Kyocera Corporation, Kyoto, JP;
Abstract
A high-frequency module is constituted by mounting a surface-acoustic-wave device on an insulating substrate constituting a surface-acoustic-wave-device mount substrate in which insulating substrate a plurality of insulating layers are laminated. A ring-shaped ground electrode of the insulating substrate is electrically connected to a predetermined conductor pattern formed on a back surface of the insulating substrate through a plurality of via-conductors including a via-conductor directly connected to the electrode. Among the plurality of via-conductors, via-conductors other than the via-conductor directly connected to the ring-shaped ground electrode are disposed outside a ring-shaped electrode region, as seen in plan view, where the ring-shaped ground electrode is formed.