The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2002
Filed:
May. 28, 1999
Koichi Nagata, Kokubu, JP;
Kenji Kitazawa, Kokubu, JP;
Shinichi Koriyama, Kokubu, JP;
Shigeki Morioka, Gamou-cho, JP;
Takanori Kubo, Kokubu, JP;
Hidehiro Minamiue, Kokubu, JP;
Masanobu Ishida, Kokubu, JP;
Akira Nakayama, Kokubu, JP;
Naoyuki Shino, Kokubu, JP;
Kyocera Corporation, Kyoto, JP;
Abstract
A high-frequency module in which a plurality of cavities are formed on the surface of a dielectric board, internal high-frequency signal transmission lines are connected to high-frequency devices in the cavities and are located in the cavities, the internal high-frequency signal transmission lines being electromagnetically coupled to the external high-frequency signal transmission line, and the high-frequency devices in the cavities are connected to each other relying on the electromagnetic coupling through the external line. The high-frequency module enables high-frequency signals to be transmitted among the high-frequency devices with a small loss. The module has a very simple structure, and is cheaply produced, and offers an advantage that it can be easily obtained in a small size.