The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2007

Filed:

Oct. 07, 2004
Applicants:

Hiroshi Kuroki, Kokubu, JP;

Hiroyuki Mori, Kokubu, JP;

Kenji Kitazawa, Kokubu, JP;

Yoshihiro Miyawaki, Kokubu, JP;

Inventors:

Hiroshi Kuroki, Kokubu, JP;

Hiroyuki Mori, Kokubu, JP;

Kenji Kitazawa, Kokubu, JP;

Yoshihiro Miyawaki, Kokubu, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/72 (2006.01); H03H 9/64 (2006.01); H03H 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A high-frequency module has a structure wherein transmitting filters, receiving filters and high-frequency power amplifiers are mounted on a multilayered substrate and wherein matching circuits are inserted between input terminals of the receiving filters and output terminals of the transmitting filters. Transmission lines as components of the matching circuits, and the like are formed internally of the multilayered substrate. Thus, the whole body of the high-frequency module can be downsized.


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