The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6961245 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 01, 2005

Filed:

Feb. 15, 2005
Applicants:

Takanori Ikuta, Kokubu, JP;

Kenji Kitazawa, Kokubu, JP;

Inventors:

Takanori Ikuta, Kokubu, JP;

Kenji Kitazawa, Kokubu, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K003/42 ; H05K007/20 ;
U.S. Cl.
CPC ...
Abstract

There is presented a high frequency module, in which a recessfor mounting power amplifier device is formed on a lower surface of a dielectric substrate, and a recessfor mounting surface acoustic wave filter is formed on an upper surface of the dielectric substrate, and a power amplifier deviceand a surface acoustic wave filterare mounted through conductive bumpsandon the recessesand, respectively. In addition, a through-hole conductorwhose one end is exposed at the lower surface of the dielectric substrateis provided between the recessesand. The exposed end of the through-hole conductoris attached to a thermal dissipation conductoron an upper surface of an external electric circuit boardthrough a brazing material


Find Patent Forward Citations

Ikuta, Takanori. (2005). High frequency module (U.S. Patent No. 6961245). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6961245

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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