IDiyas

For the Inventor, By the Inventor

Georgetown, Malaysia

Kelvin Tan Aik Boo

USPTO Granted Patents = 9

Average Co-Inventor Count = 4.3

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Singapore, SG (2022 - 2023)
  • George Town, MY (2022 - 2024)

Company Filing History:

goldMedal9 out of 37,905 
 
Micron Technology Incorporated
 patents

Years Active: 2022-2025

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9 patents (USPTO):
1. 12432859 - Surface mount device bonded to an inner layer of a multi-layer substrate (2025-09-30),
2. 12374612 - Microelectronic device packages and related methods and systems (2025-07-29),
3. 11929351 - Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer (2024-03-12),
4. 11723150 - Surface mount device bonded to an inner layer of a multi-layer substrate (2023-08-08),
5. 11710722 - Semiconductor assemblies with systems and methods for managing high die stack structures (2023-07-25),
6. 11688662 - Thermal distribution network for semiconductor devices and associated systems and methods (2023-06-27),
7. 11562987 - Semiconductor devices with multiple substrates and die stacks (2023-01-24),
8. 11527459 - Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods (2022-12-13),
9. 11282811 - Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer (2022-03-22),

Title: Innovations by Kelvin Tan Aik Boo

Introduction

Kelvin Tan Aik Boo is a notable inventor based in Georgetown, Malaysia. He has made significant contributions to the field of microelectronics, holding a total of nine patents. His work focuses on advanced substrate technologies and microelectronic device packaging.

Latest Patents

Kelvin's latest patents include a "Surface mount device bonded to an inner layer of a multi-layer substrate." This invention features a primary layer of a substrate, a secondary layer with an open area extending to an inner layer, and first component bond pads exposed via the open area. Another significant patent is for "Microelectronic device packages and related methods and systems." This patent describes a microelectronic device package that includes a microelectronic device, a masking material defined contact, and a non-masking material defined contact, facilitating electrical connections within the package substrate and redistribution layer.

Career Highlights

Kelvin Tan Aik Boo is currently employed at Micron Technology Incorporated, where he continues to innovate in the field of microelectronics. His expertise and inventions have contributed to advancements in device packaging and substrate technology.

Collaborations

Kelvin has collaborated with notable coworkers such as Hong Wan Ng and Chin Hui Chong, enhancing the innovative capabilities of his team.

Conclusion

Kelvin Tan Aik Boo's contributions to microelectronics through his patents and work at Micron Technology Incorporated highlight his role as a leading inventor in the industry. His innovations continue to shape the future of microelectronic device packaging.

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