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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11723150 B1

PDFFull Text
Date of Patent:
Aug. 08, 2023

Filed:

Sep. 04, 2020

Surface mount device bonded to an inner layer of a multi-layer substrate

Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Kelvin Tan Aik Boo, George Town, MY;

Chin Hui Chong, Braddell Hill, SG;

Seng Kim Ye, Fernvale Close, SG;

Hong Wan Ng, Singapore, SG;

Hem P. Takiar, Fremont, CA (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:

Lowenstein Sandler LLP

Primary Examiner:

Tuan T Dinh

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 25/065 (2023.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); H01L 23/13 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/642 (2013.01); H01L 25/0657 (2013.01); H05K 1/181 (2013.01); H01L 23/49816 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10159 (2013.01);
Abstract

An apparatus includes a primary layer of a substrate that includes an open area that extends through the primary layer to an inner layer of the substrate. The apparatus includes a secondary layer of the substrate. The apparatus also includes the inner layer of the substrate that is positioned between the primary layer and the secondary layer. The inner layer includes component bond pads that are disposed on the inner layer and that are exposed via the open area of the primary layer.

Find Patent Forward Citations

Boo, Kelvin Tan Aik. (2023). Surface mount device bonded to an inner layer of a multi-layer substrate (U.S. Patent No. 11723150). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11723150

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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