Thermal distribution network for semiconductor devices and associated systems and methods

Abstract

Semiconductor devices and associated systems and methods are disclosed herein. In some embodiments the semiconductor devices include a package substrate, a controller die carried by the package substrate and a spacer carried by the package substrate spaced apart from the controller die. A thermally conductive material can be carried by an upper surface of the controller die and establish a thermal path extending from the upper surface of the controller die to the package substrate. The thermal path can reach the package substrate at a position horizontally between the controller die and the spacer. The semiconductor device can also include one or more dies at least partially carried by the spacer and at least partially above the controller die and the thermally conductive material. Each of the one or more dies is thermally insulated from the thermally conductive material, for example by a thermal adhesive layer between the two.