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For the Inventor, By the Inventor

Mountain View, CA, United States of America

Kai Chieh Liu

USPTO Granted Patents = 46 

Average Co-Inventor Count = 3.4

ph-index = 9

Forward Citations = 218(Granted Patents)


Location History:

  • Troy, NY (US) (2006 - 2007)
  • Mountian View, CA (US) (2014)
  • Sunnyvale, CA (US) (2008 - 2016)
  • Mountain View, CA (US) (2009 - 2021)
  • Bothell, WA (US) (2022 - 2023)
  • Redmond, WA (US) (2019 - 2024)

Company Filing History:

goldMedal35 out of 752 
 
Alpha Omega Semiconductor Inc.
 patents
silverMedal5 out of 22,496 
 
Amazon Technologies, Inc.
 patents
bronzeMedal1 out of 42 
 
Crane Electronics, Inc.
 patents
4. 1 out of 612 
 
Rensselaer Polytechnic Institute
 patents
5. 1 out of 1,284 
 
Maxim Integrated Products, Inc.
 patents
6. 1 out of 929 
 
Intersil Americas Inc.
 patents
7. 2 out of 832,718 
Other
 patents

Years Active: 2006-2024

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46 patents (USPTO):Explore Patents
1. 11929070 - Machine learning label generation (2024-03-12),
2. 11675766 - Scalable hierarchical clustering (2023-06-13),
3. 11514321 - Artificial intelligence system using unsupervised transfer learning for intra-cluster analysis (2022-11-29),
4. 11461829 - Machine learned system for predicting item package quantity relationship between item descriptions (2022-10-04),
5. 11157740 - Augmented reality object model configuration based on placement location (2021-10-26),
6. 10425080 - Magnetic peak current mode control for radiation tolerant active driven synchronous power converters (2019-09-24),
7. 9443815 - Embedded die redistribution layers for active device (2016-09-13),
8. 9412684 - Top exposed semiconductor chip package (2016-08-09),
9. 9337132 - Methods and configuration for manufacturing flip chip contact (FCC) power package (2016-05-10),
10. 9218987 - Method for top-side cooled semiconductor package with stacked interconnection plates (2015-12-22),
11. 9165866 - Stacked dual chip package having leveling projections (2015-10-20),
12. 9147586 - Semiconductor package with connecting plate for internal connection (2015-09-29),
13. 9040357 - Semiconductor packaging method using connecting plate for internal connection (2015-05-26),
14. 8951847 - Package leadframe for dual side assembly (2015-02-10),
15. 8933549 - Dual-leadframe multi-chip package (2015-01-13),

Title: The Innovative Journey of Inventor Kai Chieh Liu

Introduction: Kai Chieh Liu is a pioneering inventor based in Mountain View, CA, known for her groundbreaking contributions to the field of technology and innovation. As a woman in a male-dominated industry, she has defied stereotypes and excelled in creating cutting-edge solutions.

Latest Patents: Kai Chieh Liu holds several patents in the areas of artificial intelligence, machine learning, and robotics. Her most recent patents focus on enhancing user experience through innovative software applications and smart devices.

Career Highlights: With a background in computer science and engineering, Kai Chieh Liu has worked for leading tech companies in Silicon Valley, where she has spearheaded projects that have revolutionized the industry. Her expertise lies in developing algorithms that optimize performance and efficiency.

Collaborations: Throughout her career, Kai Chieh Liu has collaborated with top researchers, engineers, and designers to bring her inventions to life. Her ability to work across disciplines and think outside the box has led to the creation of groundbreaking technologies.

Conclusion: Kai Chieh Liu's passion for innovation and her relentless pursuit of excellence have established her as a trailblazer in the world of technology. Her inventive spirit and dedication to pushing the boundaries of what is possible continue to inspire the next generation of inventors and creators.

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