The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2016
Filed:
Oct. 17, 2013
Applicant:
Alpha and Omega Semiconductor Incorporated, Sunnyvale, CA (US);
Inventors:
Yan Xun Xue, Los Gatos, CA (US);
Yueh-Se Ho, Sunnyvale, CA (US);
Hamza Yilmaz, Saratoga, CA (US);
Anup Bhalla, Santa Clara, CA (US);
Jun Lu, San Jose, CA (US);
Kai Liu, Mountain View, CA (US);
Assignee:
Alpha and Omega Semiconductor Incorporated, Sunnyvale, CA (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49562 (2013.01); H01L 21/561 (2013.01); H01L 23/3107 (2013.01); H01L 23/49524 (2013.01); H01L 24/40 (2013.01); H01L 24/73 (2013.01); H01L 24/48 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/40139 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/40247 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/73263 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/014 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/30107 (2013.01);
Abstract
A semiconductor package and it manufacturing method includes a lead frame having a die pad, and a source lead with substantially a V groove disposed on a top surface. A semiconductor chip disposed on the die pad. A metal plate connected to a top surface electrode of the chip having a bent extension terminated in the V groove in contact with at least one of the V groove sidewalls.