Hsinchu, Taiwan

Jun He

This inventor holds 27 USPTO granted patents and 46 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2021-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jun He. Retrieved from https://idiyas.com/inventor/jun-he-tydrc96d

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 27 

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Hsinchu, TW (2021 - 2024)
  • Hsinchu County, TW (2024)
  • Zhubei, TW (2024)

Company Filing History:


Years Active: 2021-2026

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Areas of Expertise:
Heat Sink Structure
Integrated Circuit
Semiconductor Device
Wafer-Level Testing
Cascaded Openings
Delamination Control
Dicing Method
Stacked Devices
Dielectric Layers
Thermal Management
Fan-Out Package
Protective Structure
27 patents (USPTO):Explore Patents

Title: Jun He - Innovative Inventor from Hsinchu

Introduction: Jun He is a renowned inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Jun He holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Jun He has worked with leading tech companies and research institutions, playing a pivotal role in developing cutting-edge technologies that have revolutionized the industry.

Collaborations: Jun He has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge sharing to drive forward progress in the field of technology.

Conclusion: Jun He's passion for innovation, coupled with his relentless drive to push the boundaries of what is possible, has solidified his position as a trailblazer in the world of inventions and patents.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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