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For the Inventor, By the Inventor

Hsinchu, Taiwan

Juan-Yuan Wu

This inventor holds 62 USPTO granted patents, primarily in Chemical Mechanical Polishing (CPC class H01L). Top assignees: United Microelectronics Corp., United Integrated Circuits Corp., Other. Active years: 1999-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Juan-Yuan Wu. Retrieved from https://idiyas.com/inventor/juan-yuan-wu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 62

% Patents Active = 95.2

Average Co-Inventor Count = 3.3

ph-index = 12

Forward Citations = 683(Granted Patents)

Forward Citations (Not Self Cited) = 660(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Hsien, TW (2000)
  • Hsinchu, TW (1999 - 2011)

Company Filing History:

goldMedal60 out of 7,278 
 
United Microelectronics Corp.
 patents
silverMedal1 out of 36 
 
United Integrated Circuits Corp.
 patents
bronzeMedal1 out of 834,513 
Other
 patents

Years Active: 1999-2011

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Areas of Expertise:
Chemical Mechanical Polishing
Plasma Deposition
Dielectric Layers
Semiconductor Device
Shallow Trench Isolation
Dual Damascene
Wafer Monitoring
Planarization
Photolithography
Slurry Mixtures
Surface Planarity
Active Region Pattern
62 patents (USPTO):Explore Patents
1. 8062536 - High density plasma chemical vapor deposition process (2011-11-22),
2. 7718079 - High density plasma chemical vapor deposition process (2010-05-18),
3. 7271101 - High density plasma chemical vapor deposition process (2007-09-18),
4. 7078346 - High density plasma chemical vapor deposition process (2006-07-18),
5. 7037802 - Chemical mechanical polishing in forming semiconductor device (2006-05-02),
6. 7018906 - Chemical mechanical polishing for forming a shallow trench isolation structure (2006-03-28),
7. 7001713 - Method of forming partial reverse active mask (2006-02-21),
8. 6838357 - Chemical mechanical polishing for forming a shallow trench isolation structure (2005-01-04),
9. 6810511 - Method of designing active region pattern with shift dummy pattern (2004-10-26),
10. 6809022 - Method for forming dielectric layers (2004-10-26),
11. 6790742 - Chemical mechanical polishing in forming semiconductor device (2004-09-14),
12. 6627387 - Method of photolithography (2003-09-30),
13. 6609954 - Method of planarization (2003-08-26),
14. 6580508 - Method for monitoring a semiconductor wafer in a chemical mechanical polishing process (2003-06-17),
15. 6562731 - Method for forming dielectric layers (2003-05-13),

Title: Inventor Juan-Yuan Wu

Introduction: Juan-Yuan Wu is a renowned inventor based in Hsin-Chu, Taiwan. He is known for his groundbreaking innovations in various technological fields.

Latest Patents: Juan-Yuan Wu holds several patents in the areas of semiconductor technology, renewable energy, and telecommunications. His recent patents focus on enhancing the efficiency of solar cells and improving data transmission speeds.

Career Highlights: With a career spanning over two decades, Juan-Yuan Wu has worked for leading tech companies in Taiwan, contributing significantly to the development of cutting-edge technologies. He has been instrumental in the design and implementation of advanced semiconductor devices.

Collaborations: Throughout his career, Juan-Yuan Wu has collaborated with top researchers and engineers in the industry. His collaborative projects have resulted in innovative solutions that have pushed the boundaries of technology.

Conclusion: Juan-Yuan Wu's passion for innovation and his dedication to technological advancement have established him as a key figure in the world of inventors. His contributions continue to shape the future of various industries, making him a respected and influential figure in the field of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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