IDiyas

For the Inventor, By the Inventor

Guri-si, South Korea

Ju Il Eom

USPTO Granted Patents = 14 

Average Co-Inventor Count = 2.5

ph-index = 1

Forward Citations = 5(Granted Patents)


Location History:

  • Guri-si, KR (2016 - 2020)
  • Yongin-si, KR (2021)
  • Yongin-si Gyeonggi-do, KR (2023)
  • Icheon-si, KR (2022 - 2024)
  • Icheon-si Gyeonggi-do, KR (2022 - 2024)

Company Filing History:

goldMedal14 out of 10,938 
 
Skhynix Inc.
 patents

Years Active: 2016-2024

Loading Chart...
14 patents (USPTO):Explore Patents
1. 12021515 - Semiconductor chip including chip pads of different surface areas, and semiconductor package including the semiconductor chip (2024-06-25),
2. 12015015 - Semiconductor package and semiconductor module including the same (2024-06-18),
3. 11742340 - Semiconductor package including stacked semiconductor chips (2023-08-29),
4. 11682643 - Semiconductor chip having chip pads of different surface areas, and semiconductor package including the same (2023-06-20),
5. 11682627 - Semiconductor package including an interposer (2023-06-20),
6. 11605615 - Semiconductor package and semiconductor module including the same (2023-03-14),
7. 11462511 - Semiconductor package including stacked semiconductor chips (2022-10-04),
8. 11309303 - Semiconductor package including stacked semiconductor chips (2022-04-19),
9. 11270958 - Semiconductor package including capacitor (2022-03-08),
10. 10985099 - Semiconductor packages (2021-04-20),
11. 10741529 - Semiconductor packages (2020-08-11),
12. 10224314 - Semiconductor packages (2019-03-05),
13. 10115708 - Semiconductor package having a redistribution line structure (2018-10-30),
14. 9231286 - Package substrate with band stop filter and semiconductor package including the same (2016-01-05),

Title: The Innovative Contributions of Ju Il Eom

Introduction

Ju Il Eom is a prominent inventor based in Guri-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 14 patents. His work focuses on enhancing the functionality and efficiency of semiconductor chips and packages.

Latest Patents

Among his latest patents is a semiconductor chip that includes chip pads of different surface areas. This innovative design features a chip body with a signal input/output circuit and a chip pad structure that comprises first and second chip pads. These pads have varying surface areas, and a chip pad selection circuit is integrated into the chip body to selectively connect one of the chip pads to the signal input/output circuit. Another notable patent involves a semiconductor package that includes a substrate with a bonding pad and conductive pattern, along with stacked semiconductor chips. This design optimizes the connection between the bonding wires and the chips, enhancing overall performance.

Career Highlights

Ju Il Eom is currently employed at SK Hynix Inc., a leading company in the semiconductor industry. His work at SK Hynix has allowed him to collaborate with other talented professionals in the field, contributing to advancements in semiconductor technology.

Collaborations

Some of his notable coworkers include Jae Hoon Lee and Byung Jun Bang. Their collaborative efforts have further propelled innovation within the company and the semiconductor sector.

Conclusion

Ju Il Eom's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in semiconductor design and functionality.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…