The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2023

Filed:

Apr. 26, 2021
Applicant:

SK Hynix Inc., Icheon-si Gyeonggi-do, KR;

Inventors:

Ju Il Eom, Icheon-si Gyeonggi-do, KR;

Woo Jin Lee, Icheon-si Gyeonggi-do, KR;

Hyung Ho Cho, Icheon-si Gyeonggi-do, KR;

Assignee:

SK hynix Inc., Icheon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/09 (2013.01); H01L 23/49827 (2013.01); H01L 24/08 (2013.01); H01L 24/16 (2013.01); H01L 2224/08054 (2013.01); H01L 2224/08055 (2013.01); H01L 2224/0903 (2013.01); H01L 2224/0913 (2013.01); H01L 2224/09151 (2013.01); H01L 2224/09515 (2013.01); H01L 2224/16235 (2013.01); H01L 2924/30105 (2013.01);
Abstract

A semiconductor chip includes a chip body including a signal input/output circuit unit, a chip pad unit disposed on one surface of the chip body and including first and second chip pads having different surface areas from each other, and a chip pad selection circuit unit disposed in the chip body and electrically connected to the signal input/output circuit unit and the chip pad unit. The chip pad selection circuit unit is configured to select one chip pad of the first and second chip pads and electrically connect the selected one chip pad to the signal input/output circuit unit.


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