The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Dec. 11, 2023
Applicant:
SK Hynix Inc., Icheon-si, KR;
Inventors:
Sung Mook Lim, Icheon-si, KR;
Jong Wook Kim, Icheon-si, KR;
Ju Il Eom, Icheon-si, KR;
Chang Shik Jung, Icheon-si, KR;
Assignee:
SK hynix Inc., Icheon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/65 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 70/65 (2026.01); H10W 90/701 (2026.01); H10W 90/724 (2026.01); H10W 90/754 (2026.01);
Abstract
A semiconductor package in which an auxiliary conductor is coupled to a trace pattern is presented. The semiconductor package includes a semiconductor die disposed over a package substrate including a trace pattern. The semiconductor package includes a first auxiliary conductor having a first end and a second end coupled to the trace pattern.