Jonathan David Reid

Title: Innovations and Contributions of Jonathan David Reid in the Field of Electroplating

Introduction

Jonathan David Reid, based in Sherwood, Oregon, is a prominent inventor with an impressive portfolio of 102 patents. His work is primarily focused on advancements in electroplating technology, particularly in enhancing the efficiency and effectiveness of copper plating processes.

Latest Patents

Among his latest innovations, Reid has developed a patent titled "Copper electrofill on non-copper liner layers." This invention addresses the challenge of achieving void-free bottom-up filling of copper features when working on non-copper liner layers, which exhibit higher resistivity compared to copper. The electroplating solution proposed by Reid comprises low copper concentration, high pH, organic additives, and bromide ions, functioning as a copper complexing agent. This carefully formulated solution ensures that the high pH and bromide ions do not interfere with the activity of organic additives, making the electroplating process more efficient.

Another significant innovation by Reid is related to the "Removal of electroplating bath additives." This electroplating method involves systematically managing the electrolyte solution within the bath reservoir. By implementing a dual inlet and outlet system, his method effectively removes used electrolyte solution while recycling fresh electrolyte, enhancing the overall process. The inclusion of particle filters and flow control mechanisms further optimizes the extraction of by-products, improving the sustainability of the electroplating process.

Career Highlights

Reid's career includes significant tenures at well-known companies such as Novellus Systems Incorporated and Lam Research Corporation. His experiences in these companies have contributed to his rich expertise in patentable innovations within the electroplating industry.

Collaborations

Throughout his career, Reid has had the pleasure of collaborating with notable colleagues, including Steven T. Mayer and Evan E. Patton. These collaborations have further enhanced the impact of his inventions and have contributed to the advancement of technologies in the sector.

Conclusion

Jonathan David Reid's substantial contributions to the field of electroplating, evidenced by his 102 patents, showcase his dedication to innovation. His latest patents not only address key challenges in the industry but also set a foundation for future advancements in electroplating technologies. Reid’s work continues to inspire and pave the way for future inventors and innovations.