The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2024
Filed:
Apr. 05, 2019
Lam Research Corporation, Fremont, CA (US);
Lee J. Brogan, Newberg, OR (US);
Jonathan David Reid, Sherwood, OR (US);
Yi Hua Liu, Sherwood, OR (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
Void-free bottom-up fill of copper in features is achieved on non-copper liner layers. A non-copper liner layer has a higher resistivity than copper. An electroplating solution for plating copper on a non-copper liner layer includes a low copper concentration, high pH, organic additives, and bromide ions as a copper complexing agent. The high pH and the bromide ions do not interfere with the activity of the organic additives. In some implementations, the concentration of copper ions is between about 0.2 g/L and about 10 g/L, a concentration of sulfuric acid is between about 0.1 g/L and about 10 g/L, and a concentration of the bromide ions is between about 20 mg/L and about 240 mg/L. In some implementations, the electroplating solution further includes chloride ions as an additional copper complexing agent at a concentration between about 0.1 mg/L and about 100 mg/L.