The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2017
Filed:
Apr. 24, 2013
Novellus Systems, Inc., Fremont, CA (US);
Tighe A. Spurlin, Portland, OR (US);
Charles L. Merrill, Portland, OR (US);
Ludan Huang, Tigard, OR (US);
Matthew Thorum, Tigard, OR (US);
Lee Brogan, Tualatin, OR (US);
James E. Duncan, Beaverton, OR (US);
Frederick D. Wilmot, Gladstone, OR (US);
Robert Marshall Stowell, Wilsonville, OR (US);
Steven T. Mayer, Aurora, OR (US);
Haiying Fu, Camas, WA (US);
David W. Porter, Sherwood, OR (US);
Shantinath Ghongadi, Tigard, OR (US);
Jonathan D. Reid, Sherwood, OR (US);
Hyosang S. Lee, Tigard, OR (US);
Mark J. Willey, Portland, OR (US);
Novellus Systems, Inc., Fremont, CA (US);
Abstract
Apparatus and methods for electroplating metal onto substrates are disclosed. The electroplating apparatus comprise an electroplating cell and at least one oxidization device. The electroplating cell comprises a cathode chamber and an anode chamber separated by a porous barrier that allows metal cations to pass through but prevents organic particles from crossing. The oxidation device (ODD) is configured to oxidize cations of the metal to be electroplated onto the substrate, which cations are present in the anolyte during electroplating. In some embodiments, the ODD is implemented as a carbon anode that removes Cu(I) from the anolyte electrochemically. In other embodiments, the ODD is implemented as an oxygenation device (OGD) or an impressed current cathodic protection anode (ICCP anode), both of which increase oxygen concentration in anolyte solutions. Methods for efficient electroplating are also disclosed.