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Tighe A Spurlin

This inventor holds 12 USPTO granted patents and 10 published patent applications. Top assignees: Lam Research Corporation, Novellus Systems Incorporated. Active years: 2015-2026.

USPTO Granted Patents = 12 (Patent Applications = 10)

% Patents Active = 100.0

Average Co-Inventor Count = 4.1

ph-index = 3

Forward Citations = 29(Granted Patents)

Company Filing History:

7 out of 3,936

Lam Research Corporation

patents

5 out of 993

Novellus Systems Incorporated

patents

Years Active: 2015-2026

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12 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12535454 - Leveling compound control (2026-01-27),

2. 11280022 - Removal of electroplating bath additives (2022-03-22),

3. 11208732 - Monitoring surface oxide on seed layers during electroplating (2021-12-28),

4. 10745817 - Configuration and method of operation of an electrodeposition system for improved process stability and performance (2020-08-18),

5. 10711366 - Removal of electroplating bath additives (2020-07-14),

6. 10443146 - Monitoring surface oxide on seed layers during electroplating (2019-10-15),

7. 9865501 - Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer (2018-01-09),

8. 9816196 - Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte (2017-11-14),

9. 9816193 - Configuration and method of operation of an electrodeposition system for improved process stability and performance (2017-11-14),

10. 9472377 - Method and apparatus for characterizing metal oxide reduction (2016-10-18),

11. 9385035 - Current ramping and current pulsing entry of substrates for electroplating (2016-07-05),

12. 9070750 - Methods for reducing metal oxide surfaces to modified metal surfaces using a gaseous reducing environment (2015-06-30),

Title: Tighe A Spurlin: Innovator in Electroplating Technologies

Introduction

Tighe A Spurlin is a notable inventor based in Portland, OR (US), recognized for his contributions to the field of electroplating. With a total of 12 patents to his name, Spurlin has developed innovative methods and apparatus that enhance the efficiency and effectiveness of electroplating processes.

Latest Patents

Among his latest patents, one focuses on the removal of electroplating bath additives. This method involves feeding fresh electrolyte solution into a bath reservoir while simultaneously bleeding used electrolyte solution out. The process includes recycling the electrolyte solution and extracting by-products generated by a plating cell using an extraction column. Additionally, he has developed methods for monitoring surface oxide on seed layers during electroplating. This involves determining the oxide levels on substrates directly within an electroplating apparatus, allowing for real-time adjustments during the electroplating process.

Career Highlights

Throughout his career, Tighe A Spurlin has worked with prominent companies in the semiconductor industry, including Lam Research Corporation and Novellus Systems Incorporated. His work has significantly impacted the development of advanced electroplating technologies.

Collaborations

Spurlin has collaborated with various professionals in his field, including Jonathan David Reid and Shantinath Ghongadi. These collaborations have contributed to the advancement of his innovative projects and patents.

Conclusion

Tighe A Spurlin's work in electroplating technologies showcases his dedication to innovation and improvement in manufacturing processes. His patents reflect a commitment to enhancing the efficiency of electroplating, making significant contributions to the industry.

Profile summary based on public USPTO records.

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