Tigard, OR, United States of America

Hyosang S Lee

USPTO Granted Patents = 1 

Average Co-Inventor Count = 15.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2017

where 'Filed Patents' based on already Granted Patents

1 patent (USPTO):

Title: The Innovations of Hyosang S Lee in Semiconductor Electroplating

Introduction

Hyosang S Lee, an inventor based in Tigard, OR, has made significant contributions to the field of semiconductor technology. With one patent to his name, he has developed innovative methods and apparatuses for the electroplating of semiconductor wafers. His work underscores the importance of advancing manufacturing processes in semiconductor production.

Latest Patents

Hyosang S Lee's notable patent is titled "Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte." This patent focuses on the apparatus and methods for electroplating metal onto substrates. The electroplating apparatus includes a cathode chamber and an anode chamber, separated by a porous barrier that facilitates the passage of metal cations while preventing organic particles from crossing. Additionally, his invention incorporates an oxidation device to enhance the efficiency of the electroplating process.

Career Highlights

Hyosang S Lee has been associated with Novellus Systems Incorporated, a company well-regarded for its technological advancements in semiconductor manufacturing. His role in developing methods for efficient electroplating has contributed to enhanced process reliability and quality in semiconductor fabrication.

Collaborations

Throughout his career, Hyosang has had the opportunity to work alongside notable colleagues, including Tighe A Spurlin and Charles Lorenzo Merrill. Their collaborative efforts have undoubtedly enriched the innovative environment at Novellus Systems, fostering a culture of creativity and technical advancement.

Conclusion

Hyosang S Lee exemplifies the spirit of innovation within the semiconductor industry. His unique approach to electroplating has the potential to influence future developments in the field. As he continues to contribute to advancements in semiconductor technology, his work remains a testament to the role of inventors in shaping the future of electronic manufacturing.

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