Novellus Systems Incorporated

Hyosang S Lee

Steven T Mayer

Jonathan David Reid

David W Porter

Shantinath Ghongadi

Haiying Fu

Matthew S Thorum

Frederick Dean Wilmot

Tighe A Spurlin

Mark J Willey

Robert Marshall Stowell

Lee J Brogan

James E Duncan

Ludan Huang

Charles Lorenzo Merrill

Apparatus and methods for electroplating metal onto substrates are disclosed. The electroplating apparatus comprise an electroplating cell and at least one oxidization device. The electroplating cell comprises a cathode chamber and an anode chamber separated by a porous barrier that allows metal cations to pass through but prevents organic particles from crossing. The oxidation device (ODD) is configured to oxidize cations of the metal to be electroplated onto the substrate, which cations are present in the anolyte during electroplating. In some embodiments, the ODD is implemented as a carbon anode that removes Cu(I) from the anolyte electrochemically. In other embodiments, the ODD is implemented as an oxygenation device (OGD) or an impressed current cathodic protection anode (ICCP anode), both of which increase oxygen concentration in anolyte solutions. Methods for efficient electroplating are also disclosed.

Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte

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Tigard, OR, United States of America

Hyosang S Lee