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For the Inventor, By the Inventor

Tokyo, Japan

Jitsuo Kanazawa

This inventor holds 17 USPTO granted patents, primarily in Light Emitting Devices. Top assignee: Tdk Corporation. Active years: 2001-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jitsuo Kanazawa. Retrieved from https://idiyas.com/inventor/jitsuo-kanazawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 17

% Patents Active = 76.5

Average Co-Inventor Count = 3.2

ph-index = 7

Forward Citations = 235(Granted Patents)


Location History:

  • Ibaraki, JP (2001 - 2004)
  • Chuo-ku, JP (2003 - 2004)
  • Tokyo, JP (2001 - 2010)

Company Filing History:

goldMedal17 out of 8,282 
 
Tdk Corporation
 patents

Years Active: 2001-2010

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Areas of Expertise:
Light Emitting Apparatus
Ultrasonic Bonding
Electronic Parts
Acoustic Wave Device
Chip Junction Nozzle
Resin Package
Wiring Board
Substrate Manufacturing
Surface-Mounted Components
Water Treatment Apparatus
Bonding Areas
Fabrication Process
17 patents (USPTO):Explore Patents
1. 7671468 - Light emitting apparatus (2010-03-02),
2. 7505239 - Light emitting device (2009-03-17),
3. 7355251 - Light emitting device (2008-04-08),
4. 6749183 - Production method of electronic parts and water treatment apparatus (2004-06-15),
5. 6730858 - Circuit board having bonding areas to be joined with bumps by ultrasonic bonding (2004-05-04),
6. 6565687 - Ultrasonic bonding method (2003-05-20),
7. 6471783 - Production method of electronic parts and water treatment apparatus (2002-10-29),
8. 6460591 - Ultrasonic bonding method and ultrasonic bonding apparatus (2002-10-08),
9. 6417026 - Acoustic wave device face-down mounted on a substrate (2002-07-09),
10. 6382495 - Chip junction nozzle (2002-05-07),
11. 6320739 - Electronic part and manufacturing method therefor (2001-11-20),
12. 6282781 - Resin package fabrication process (2001-09-04),
13. 6281436 - Encapsulated surface mounting electronic part (2001-08-28),
14. 6263565 - Method of manufacturing a substrate having electrode arcs for connecting to surface-mounted electronic parts and substrate manufactured by same (2001-07-24),
15. 6204454 - Wiring board and process for the production thereof (2001-03-20),

Title: Jitsuo Kanazawa: Innovator in Light Emitting Technology

Introduction

Jitsuo Kanazawa is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of light emitting technology, holding a total of 17 patents. His innovative work has paved the way for advancements in semiconductor devices and light emitting apparatuses.

Latest Patents

Among his latest patents, Kanazawa has developed a light emitting apparatus that features a multilayer chip varistor. This apparatus includes a varistor element body, a semiconductor light emitting element, and a reflecting portion. The varistor element body consists of a varistor layer and multiple internal electrodes that are arranged to interpose the varistor layer. The semiconductor light emitting element is connected to these internal electrodes, allowing for efficient light emission. Additionally, he has created a light emitting device that integrates a semiconductor light emitting element with a multilayer chip varistor, enhancing the performance and reliability of light emitting technologies.

Career Highlights

Kanazawa is currently employed at TDK Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of light emitting devices, making them more efficient and effective for various applications.

Collaborations

Throughout his career, Kanazawa has collaborated with notable colleagues such as Masashi Gotoh and Syuichiro Yamamoto. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Jitsuo Kanazawa's contributions to light emitting technology exemplify his dedication to innovation and excellence. His patents and collaborative efforts continue to influence the industry, making him a key figure in the field of semiconductor technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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