The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2001
Filed:
Apr. 16, 1999
TDK Corporation, Tokyo, JP;
Abstract
An electronic part in which a chip,having bump electrodes is sealed in a cavity,of a resin container,, wherein the resin container having: a mounting board,having a conductor pattern,for bump-mounting the chip,; an intermediate board,overlaid on the mounting board,and having a window for forming an inner wall apart from the chip,for predetermined distances; a cover board overlaid on the intermediate board,to cover the window; a first adhesive layer,which is interposed between overlaid portions of the mounting board,and the intermediate board,; and a second adhesive layer,which is interposed between overlaid portion of the intermediate board,and the cover board,, wherein the first and second adhesive layers,and,between which the intermediate board,is interposed are heated and pressed at a time in a direction of the thickness of each of the mounting board,and the cover board,, and the mounting board,, the intermediate board,and the cover board,are brought into intimate contact with one another so as to seal and form the cavity,defined by the inner wall of the window.