The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 04, 2004
Filed:
Jul. 21, 1998
Applicant:
Inventors:
Masashi Gotoh, Ibaraki, JP;
Jitsuo Kanazawa, Ibaraki, JP;
Syuichiro Yamamoto, Chiba, JP;
Kenji Honda, Ibaraki, JP;
Assignee:
TDK Corporation, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/16 ;
U.S. Cl.
CPC ...
H05K 1/16 ;
Abstract
A circuit board for mounting a part having a plurality of bumps by ultrasonic bonding. The circuit board includes a main body and a conductive layer provided on the main body. The conductive layer has a conductive pattern having at least one bonding area configured to correspond to the plurality of bumps of the part. The conductive layer has an isolated notch part located proximate the at least one bonding area.