The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2001
Filed:
Dec. 17, 1998
TDK Corporation, Tokyo, JP;
Abstract
A resin package fabrication processes comprises three steps. At the first step, a thermosetting resin-containing resin substrate is machined. At the second step carried out after the first step, the resin substrate is heated to an original glass transition temperature that the resin substrate has or a temperature that is higher than the glass transition temperature so that the glass transition temperature that the resin substrate has is elevated to a new glass transition temperature. At the third step, a resin layer is placed on at least a portion of the resin substrate to which the new glass transition temperature is imparted, and the resin substrate with the resin layer placed on that portion is then heated to the original glass transition temperature or a temperature between the original glass transition temperature and the new glass transition temperature, thereby fixing the resin layer to the resin substrate.