The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2002
Filed:
Apr. 06, 2000
Applicant:
Inventors:
Assignee:
TDK Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/100 ;
U.S. Cl.
CPC ...
B32B 3/100 ;
Abstract
When connecting electrodes of a chip device CP are ultrasonic-bonded to circuit electrodes provided for a resin substrate to mount the chip device CP on the resin substrate a heater for heating the resin substrate is provided with which the temperature of the resin substrate is raised to a level with which the ratio of elastic modulus &egr;h realized when heat is supplied with respect to elastic modulus &egr;r of the resin substrate at room temperature satisfies 1>&egr;h/&egr;r≧0.5. The heater may be provided for the substrate retaining frame