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For the Inventor, By the Inventor

Shanghai, China

Jinghua Ye

This inventor holds 23 USPTO granted patents and 5 published patent applications, primarily in MEMS Microphone Technology. Top assignees: Zilltek Technology Corporation, Zilltek Technology (Shanghai) Corp., Analog Devices,inc.. Active years: 2011-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jinghua Ye. Retrieved from https://idiyas.com/inventor/jinghua-ye

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23 

% Patents Active = 95.7

Average Co-Inventor Count = 1.1

ph-index = 4

Forward Citations = 36(Granted Patents)


Location History:

  • Xinzhu, TW (2015)
  • Shanghai, CN (2011 - 2023)

Company Filing History:

goldMedal11 out of 12 
 
Zilltek Technology Corporation
 patents
silverMedal10 out of 10 
 
Zilltek Technology (Shanghai) Corp.
 patents
bronzeMedal2 out of 3,701 
 
Analog Devices,inc.
 patents
4. 1 out of 1 
 
Shangai Sniper Microelectronics Co., Ltd.
 patent
5. 1 out of 1 
 
Shanghai Sniper Microelectronics
 patent
6. 1 out of 1 
 
Shanghai Sniper Microelectronics Co. Ltd.
 patent
7. 1 out of 1 
 
Telltek Technology Corp.
 patent
8. 6 out of 834,513 
Other
 patents
where one patent can have more than one assignee

Years Active: 2011-2023

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Areas of Expertise:
MEMS Microphone
Hybrid Packaging
Sound Amplification
Electronic Device
Microphone Structure
Bone Conduction Sensor
Transducer
Waterproof Microphone
Voice Wake-Up Function
Digital Electret Microphone
Mechanical Switch
Audio Player
23 patents (USPTO):Explore Patents
1. 11856364 - Microphone array system with sound wire interface and electronic device (2023-12-26),
2. 11849282 - Online trimmed MEMS microphone and electronic device (2023-12-19),
3. 11700481 - Variable-directivity MEMS microphone and electronic device (2023-07-11),
4. 11197079 - MEMS microphone with hybrid packaging structure (2021-12-07),
5. 11172279 - Microphone with combined packaging structure (2021-11-09),
6. 11146896 - Mems microphone with improved connection structure and method for manufacturing the same (2021-10-12),
7. 11102562 - Microphone encapsulation structure having a plurality of transducers (2021-08-24),
8. 11051093 - Microphone structure with improved substrate (2021-06-29),
9. 11039254 - MEMS-based bone conduction sensor (2021-06-15),
10. 10863283 - MEMS microphone for frame-free device (2020-12-08),
11. 10848845 - Microphone with mechanical switch function (2020-11-24),
12. 10547924 - Microphone structure and flip-type electronic device (2020-01-28),
13. 10542349 - Electronic device and microphone structure with enhanced back cavity (2020-01-21),
14. 10484799 - Photoelectric MEMS microphone and electronic device (2019-11-19),
15. 10448134 - Two-wire type microphone with ultrasonic identification (2019-10-15),

Title: Inventor Jinghua Ye - Revolutionizing Technology in Shanghai

Introduction: Jinghua Ye is a pioneering inventor based in Shanghai, China, known for her groundbreaking contributions to the field of technology.

Latest Patents: Jinghua Ye holds several patents in the areas of artificial intelligence, robotics, and renewable energy technologies, showcasing her innovative mindset and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Jinghua Ye has worked with top research institutions and leading tech companies to develop cutting-edge solutions that have had a significant impact on various industries.

Collaborations: Throughout her career, Jinghua Ye has collaborated with renowned scientists, engineers, and fellow inventors to push the boundaries of technological advancements and bring revolutionary ideas to life.

Conclusion: Jinghua Ye's passion for innovation and her relentless drive to create a better future through technology make her a standout figure in the world of inventions. Her work continues to inspire and shape the landscape of modern technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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