The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

Nov. 10, 2020
Applicants:

Zilltek Technology (Shanghai) Corp., Shanghai, CN;

Zilltek Technology Corp., Hsinchu, TW;

Inventor:

Jinghua Ye, Shanghai, CN;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/08 (2006.01);
U.S. Cl.
CPC ...
H04R 1/08 (2013.01); H04R 2201/003 (2013.01);
Abstract

A microphone with a combined packaging structure includes: a substrate, a first cover being provided on top of the substrate, the substrate, together with the first cover, forms a first accommodating cavity, an acoustic sensor being provided inside the first accommodating cavity, and an acoustic through-hole being formed in the first accommodating cavity. A second cover is provided on a back face of the substrate, the second cover, together with the substrate, forms a second accommodating cavity, and a proximity sensor is arranged inside the second accommodating cavity. By adopting the above-mentioned technical solutions, the present invention has the beneficial effects that two accommodating cavities are respectively provided on the top and bottom of the substrate in the microphone according to the present invention, for receiving components of a MEMS microphone and the components of a proximity sensor respectively.


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