The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2020

Filed:

May. 30, 2018
Applicants:

Zilltek Technology (Shanghai) Corp., Shanghai, CN;

Zilltek Technology Corp., Hsinchu, TW;

Inventor:

Jinghua Ye, Shanghai, CN;

Assignees:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); H04R 1/08 (2006.01); H04R 31/00 (2006.01); H04R 1/06 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); H04R 1/06 (2013.01); H04R 1/08 (2013.01); H04R 31/00 (2013.01); H04R 2201/003 (2013.01);
Abstract

The invention relates to the field of micro-electromechanical technology, and more particularly, to a microphone structure with an enhanced back cavity and an electronic device, comprising: a first layer plate, an groove is configured on the first layer plate, wherein an acoustic sensor is installed above the groove by means of a support, and the acoustic sensor is provided with a back cavity facing towards the support, and a through-hole for penetrating through the back cavity and the groove is provided on the support; a second layer plate, covering the first layer plate, wherein an acoustic through-hole is configured on the second layer plate; wherein, the first layer plate and second layer plate form a microphone acoustic cavity. The beneficial effects of the technical solutions of the invention are as follows: a microphone structure with an enhanced back cavity and an electronic device is disclosed, which boasts low cost and simple manufacturing process, wherein the volume of the back cavity is effectively enlarged, the sensitivity inside of the microphone structure is enhanced, and the acoustic performance of the microphone structure is improved, such that the tone quality received by the electronic product becomes better.


Find Patent Forward Citations

Ye, Jinghua. (2020). Electronic device and microphone structure with enhanced back cavity (U.S. Patent No. 10542349). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10542349

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